Der M5 Pro Chip könnte im 'Serverklasse'-Chips die CPU und GPU trennen.

A key element of the Apple A- and M-series chips is the System-on-a-Chip (SoC) design, which integrates all components into a single package. This includes both the CPU and GPU.

However, a new report suggests that the M5 Pro chip may take a different approach by separating the CPU and GPU more significantly to improve performance and increase production capacity …

Chip-in-a-Component Methodology

Traditional computers and computer-like devices had a completely separate CPU (central processor) and GPU (graphics processor), often on entirely separate printed circuit boards.

With the iPhone, Apple integrated the two components in a method known as System-on-a-Chip (SoC). Essentially, separate chips would be completely separate and now are condensed into a single, tightly integrated module that contains the circuits for both. Apple has also applied this method to other devices, including M-series chips for Macs with Apple Silicon.

Whether we consider this as a single chip or a compact package of various chips is largely a matter of semantics. But Apple refers to individual chips – such as the A18 Pro chip and the M4 chip.

M5-Pro Chip with Separate CPU and GPU

The analyst for Apple, Ming-Chi Kuo, claims that for the M5 Pro chip, Apple will use the latest chip packaging technology from TSMC known as SoIC-mH (System-on-Integrated-Chips-Molding-Horizontal).

SoIC-mH refers to a method of integrating various chips into a package that improves thermal performance, allowing a chip to operate at full capacity for longer before requesting its power be reduced to cool down. It is also reported that this will increase production efficiency as fewer chips fail quality control.

Kuo's report states that this approach will be used for the M5 Pro-, Max- and Ultra-variants of the upcoming M5 chip.

The M5 series chips will use TSMC's advanced N3P node, which was introduced in prototype form a few months ago. Mass production of M5, M5 Pro/Max, and M5 Ultra is expected for the first half of 2025, with the second half of 2025 and 2026 corresponding.

The M5 Pro, Max, and Ultra will use server-class SoIC packages. Apple will use a 2.5D package named SoIC-mH (horizontal molding) to improve production efficiency and thermal performance with separate CPU and GPU designs.

Interestingly, it was previously reported that the iPhone 18 would begin processing various elements of the A-series chip individually, although this report references RAM – which is also currently integrated into the chip.

will also be used to operate Apple Intelligence servers

Kuo also stated that M5-Pro chips would be used in Apple Intelligence servers known as Private Cloud Computing (PCC).

The infrastructure of Apple's PCC will accelerate after the mass production of high-quality M5 chips begins, which are better suited for AI inference.