N3P node.

The M5 Pro processor could separate the CPU and GPU in 'server motherboards'.

Apple A-Series and M-Series processors traditionally use a System-on-a-Chip (SoC) design to integrate both CPU and GPU into a single package. However, a new report suggests that the M5 Pro processor might adopt a more separated CPU and GPU approach to improve performance and boost production rates. This approach will utilize TSMC's advanced SoIC-mH packaging process, which enhances thermal performance and increases production efficiency. The M5 Pro, Max, and Ultra variants are scheduled for mass production in 2025-2026. Additionally, these processors will be used in Apple's cloud intelligence servers to accelerate AI inference capabilities. [Plus...]